Электронные Книги

Техническая литература, научная литература, электронные книги и журналы, химическая литература, компьютерная литература, кулинарные книги, научная библиотека, электротехника, научная литература, учебная литература в pdf и djvu

Advanced Thermal Design of Electronic Equipment

Advanced Thermal Design of Electronic Equipment
Ткомедиограф:Remsburg R.
Название: Advanced Thermal Design of Electronic Equipment
Издательство: Chapman & Hall
Время: 1998
Формат: PDF
Размер:24.23mb
язык: английский
Для сайта: MirKnig.com

The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased.

Комментарии закрыты.